Electronics Forum: solder joint partially reflowed (Page 6 of 106)

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris

Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas

Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas

There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i

SMD pad definition may cause solder joint cracking under extreme fatigue conditions.

Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar

Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 16:07:44 EDT 1998 | G. Hamblett

Looking for articles/data comparing the quality/reliability of mass reflowed SMT solderjoints versus hand soldered SMT solderjoints.

Tension on a SMT joint at the Solder wave process

Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner

Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl

Re: Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon

| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B

VOIDS on Solder joint (backside of D2PAK heatsink)

Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan

Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho

BGA Solder joint appearance for the Motorola 860

Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef

While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER


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