Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Thu Jun 04 14:35:11 EDT 2009 | floydf
We wound up using a ramp to spike profile with 50 sec. between 150C and 217C and 90 sec. above 217C. The idea being the flux is still active when it hits reflow, and it stays in reflow long enough for the weird alloy in the parts lead to wet. All par
Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.
| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Jan 19 20:25:52 EST 1998 | Steve Gregory
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon Jan 26 11:46:16 EST 1998 | Rin Or
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
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