Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm
Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef
Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain
The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 12:04:45 EST 2002 | dason_c
You can use the IPC-7525, Stencil Design Guidelines for start up.
