Electronics Forum | Wed Feb 22 08:01:42 EST 2006 | INGE
We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For exam
Electronics Forum | Thu Feb 23 12:17:47 EST 2006 | mafc65
As Russ say, you can buy kits from Practical components and make your tries, the send those pcb's to your solder paste vendor for analysis.I am using Senju Lead free solder and I send boards to them then they cut the board and analyze your solder con
Electronics Forum | Wed Dec 15 16:17:30 EST 2010 | rgduval
Sounds like there may be a people problem somewhere in your process. We have a couple of checks set up to aid with capturing first article issues. First, of course, the kit is checked against the BOM to ensure that all of the parts match. Then, we
Electronics Forum | Tue May 31 16:52:57 EDT 2011 | xray
Hi SSager, Check out the FA Inspector. It provides 1 Automatic Detection Mode and 2 Manual Inspection Modes. Its used to automate First Article Inspection Tasks and enhance today's principally manual process using microscopes and pen and paper. T
Electronics Forum | Thu Feb 23 02:46:16 EST 2006 | INGE
It isn't an FDA validation. I think Steve has centered the problem. I have already defined all the steps and all the procedures of the process, but now I must run X boards, Y times, through each piece of equipment (as he said before); the question is
Electronics Forum | Thu Feb 23 10:49:38 EST 2006 | slthomas
Defining failure modes will help determine what you need to quantify in all processes. Personally I wouldn't pursue the DoE angle (varying setup parameters to determine robustness). 1)How about % pad coverage, paste thickness, and accuracy? Define w
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef
Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
