Electronics Forum | Wed Oct 03 17:08:32 EDT 2001 | davef
No comment or intent to appear critical on your particular situation, because you did the troubleshooting to determine the source of the problem, but �solder on the component lead, but not on the pad� is more often caused by a reflow profile that get
Electronics Forum | Fri Dec 14 13:58:07 EST 2001 | slthomas
This is one I haven't seen before (not in this context, anyway). We have an assembly that we have the SMT done out of house on, because of the high volumes. The boards have two distinct characteristics with respect to the appearance of the solder jo
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc
>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,
Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Mon Dec 13 09:43:28 EST 1999 | Chris May
As Wolfang says about slightly bent legs, handling is of the essence. Are these devices decanted into another tray for your machine. It may be worthwhile doing a "movement" chart for these components. Do not explain why or when you are doing it beca
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Thu Nov 01 03:10:07 EST 2001 | Brian Sloth Bentzen
Will the gold from some Ni/Au surfaces make the solder joints appear dull and a slightly rugged on the surface ? Does anyone have any experience with this ? Thanks !
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
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