Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch
I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr
Electronics Forum | Mon Dec 27 13:28:11 EST 1999 | Brian W.
Depending on the components you are seeing this on, one thing to check would be the solderability of the parts. Sometimes you will find the plating leeches away, and this is a component plating issue. When you solder, the plating actually leeches a
Electronics Forum | Fri Jun 11 03:14:03 EDT 2010 | muarty
Thanks Dax, We currently employ a stencil aperture design pretty much similar to that you describe. And you are correct in what you say about the thermal demands almost dictating the allowable voiding level. We have suggested to our customer that th
Electronics Forum | Mon May 29 23:39:11 EDT 2006 | Faizal
Can anyone advice me on the effect of SN100C wave solder on SAC305 hasl board? I suppose the silver content on the hasl pcb would leech(contaminate) into solder pot.? Would it affect the surface bonding between copper pad and the solder.?
Electronics Forum | Tue Feb 15 13:47:59 EST 2000 | Stu Leech
We have just completed a test for a leading manufacturer of SMT IC packages. There were some surprises. The carrier and cover tapes appear to be highly hygoscopic. The saturation curves for the tape and devices showed dramatic absorption at the begin
Electronics Forum | Tue Aug 14 21:43:44 EDT 2001 | mugen
Basic understanding, 1) the 2% silver (Ag) gives better shine *joint surface*. 2) Ag improves stength & fatigue resistance of solder joints 3) reduces leech-out of silver from silver-base substrates (eg of such silver-base surface contact: metalli
Electronics Forum | Fri Dec 31 20:21:26 EST 1999 | Stu Leech
Intel had a similar problem with one of their military packages. They had "dull" leads. QC screamed loudly about this because the "dull" leads looked like a solder-coating problem. (Actually the solderability was equal or better than the "shinny" lea
Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory
| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to
