Electronics Forum | Thu Aug 19 04:49:09 EDT 1999 | Earl Moon
| | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large scale
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Thu Jun 04 22:59:10 EDT 1998 | Dave F
We have dispensed latex peelable solder mask, but want to begin printing. What are your experiences with: 1 Mask types ... latex versus vinyl? We're edging towards vinyl 2 Stencil or screen? We're aiming towards stencil 3 Metal or plastic stenci
Electronics Forum | Sat Aug 15 13:26:05 EDT 1998 | Bob Willis
| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? The European standard often quoted is 1.5 mg/cm which ia achievable on a board assembly please remember one
Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
Electronics Forum | Fri Jun 30 14:13:23 EDT 2023 | calebcsmt
Is a bridge considered a defect, if adjacent pads/component leads are electrically connected (common) via a trace but said trace is covered in solder mask ? Essentially, of course bridges are never a target but is rework required/de-bridging require
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
