Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy
I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look
Electronics Forum | Tue Dec 17 17:47:49 EST 2002 | Tim Marc
Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I also referred to the annular ring of the Plated-Through-Hole, being coated with solder mask. Semantics, yes I did refer to the Plated-Through-Hole (Sup
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Tue Dec 17 16:27:02 EST 2002 | davef
I�m not clear on the problem. What I get: * Your fabricator did not deliver the product that you asked for in your purchase order. * Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed ci
Electronics Forum | Mon Aug 09 04:15:33 EDT 1999 | Jacqueline Coia
I am having cleaning problems when processing PCB's which have TAIYO solder mask on them. After processing, hand soldering and cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks do no
Electronics Forum | Wed Jul 06 06:17:11 EDT 2016 | pavel_murtishev
Dear members, Recently we have found that solder mask thickness variation could lead to solder balling under QFN packages for a high reliability device. Is there any industry proven method for solder mask thickness checking? Any equipment or any me
Electronics Forum | Wed Jul 06 09:07:28 EDT 2016 | davef
Hi Pavel IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards, Paragraph: Solder Resist (Solder Mask) Requirements, Sub-paragraph: Solder Resist Thickness has words to the effect … * Solder mask thickness shall be accordi
Electronics Forum | Wed Aug 22 21:44:04 EDT 2007 | davef
Questions are: * Do these boards meet IPC-A-600? * What does your supplier say is the source of this color variation? * What steps is your supplier taking to make the boards more acceptable?
Electronics Forum | Fri Jul 06 00:22:49 EDT 2001 | DL
Thanks Dave, and yes we can leave the solder there in this instance. These panels, 12up, are NCMR from the customer. The customer is saying that after the panels have been reflowed 5 times! solder starts to accumulate under the mask. Get this, My sen
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