Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
Electronics Forum | Thu Aug 20 04:37:03 EDT 2009 | sergey2007
Hi, I also paid attention on the solder balls.. I thought it was because of the pop-corning, but the customer told me the component was not damaged.. Regarding the bunch of tented vias, I need to ask the customer about that. Probably, they have unpo
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Thu Jun 04 09:29:21 EDT 1998 | Chrys
I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after and r
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Mon Sep 09 12:00:01 EDT 2013 | proteus
I have a 208 pin QFP that due to manufacture obsolescence I have to get them form the broker market. I've had several issues with the parts including; bent leads, leads that don't take solder very well, co-planarity problems, and DOA fallout after a
Electronics Forum | Sat Apr 30 13:56:31 EDT 2005 | steve
My experience with different size boards and pre-heaters. The perfect world (right?) you would saturate the complete pcb with bottom pre-heat. But it is difficult with repair and rework equipment, not to mention the expense and foot print of large pr
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Thu Jun 04 11:09:50 EDT 1998 | Justin Medernach
| I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after and
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