Electronics Forum | Thu Dec 13 20:54:23 EST 2001 | davef
There is neither �nominal thickness� nor �is there a set maximum� for via masking. We use some of our vias as test pads. So, as you�d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Pri
Electronics Forum | Thu Aug 12 05:33:23 EDT 1999 | Brian
| | (snip) | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a little later on
Electronics Forum | Thu Aug 12 22:23:23 EDT 1999 | Dave F
| | | | (snip) | | | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a little
Electronics Forum | Fri Aug 13 10:39:25 EDT 1999 | Boca
| | | | | | (snip) | | | | | | | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a
Electronics Forum | Fri Jun 07 10:46:16 EDT 2019 | gregoryyork
The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt
Electronics Forum | Wed Jul 23 08:18:29 EDT 2008 | davef
Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special pl
Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew
We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi
Electronics Forum | Sun Nov 24 20:43:15 EST 2019 | sssamw
If you want to check if solder mask on tented via, better to do cross section to have a clear view. Sometime supplier will not tell you the truth once you ask question for potential quality issue.
Electronics Forum | Fri Nov 22 16:19:45 EST 2019 | davef
I'd guess ... + Pads have no solder mask, clear or otherwise. + Pads won't take solder, because you're trying to solder to nickel. + Nickel on the pads is oxidized and is sticking out its tongue at the flux you're using. + Something went south
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
