Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Tue Mar 07 22:53:59 EST 2000 | Greenman
Ken: Placings are in terms of volume or quality??...and which item? You're asking for pretty sensitive information, here!
Electronics Forum | Tue Mar 07 22:53:59 EST 2000 | Greenman
Ken: Placings are in terms of volume or quality??...and which item? You're asking for pretty sensitive information, here!
Electronics Forum | Tue Jan 29 09:19:56 EST 2002 | bob_smith
Can someone tell me what metal substrates are comonly used for component leads with gold plating? If the gold plating is missing, are any of the substates incompatible with 63/37 solder? Thanks.
Electronics Forum | Mon Apr 12 11:32:47 EDT 2004 | Luis Lazcano
Can you share some information on the hazardous materials and cleaning details for your manufacturing processes, please ? These are the questions I need to ask you: 1. Do you use brominated fire retardant in PWB material? If not, what other type
Electronics Forum | Tue Aug 05 03:22:48 EDT 2003 | emeto
Hi, Does anyone knows what's the rate for used materials for making soloder pastes? I found some charts, but they are old. I'm interested is leadfree already the most used and should I change my paste?
Electronics Forum | Fri Aug 08 13:00:41 EDT 2003 | davef
What do you mean? I'm sorry I don't understand. Please be specific or give more background.
Electronics Forum | Thu Aug 27 21:59:56 EDT 1998 | Xingsheng
Hi, Friends, Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! Have a good day Xingsheng
Electronics Forum | Fri Aug 27 11:57:49 EDT 2004 | Dreamsniper
REFLOW SOLDERING PROCESSES AND TROUBLESHOOTING: SMT, BGA, CSP AND FLIP CHIP TECHNOLOGIES By Ning Checng Lee http://www.argospress.com/Resources/business/book-0750672188.htm regards,
Electronics Forum | Fri Aug 27 15:00:42 EDT 2004 | davef
Dr Lee's book mentioned above is very good. Also consider: IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
