Electronics Forum | Tue May 07 12:50:17 EDT 2019 | sankarseptember
Thanks for the response Thomas..You are correct I got solder paste on both edge on the nozzle type 4007. But it uses for nearly 30 types of part number ..and also I will get missing without any issues in nozzle..I am unable to find the trace in that.
Electronics Forum | Tue May 07 13:49:05 EDT 2019 | tey422
Like I stated before, I am not familiar with the machine. I can only make suggestions. If you found solder paste on the nozzle, clean it off to prevent part stuck to the nozzle tip. I would also check if the nozzle tips are being worn off; uneven we
Electronics Forum | Mon May 06 16:34:20 EDT 2019 | tey422
First of all, I am not familiar with the machine you stated. But there is something you should check out. That is if the nozzle tips having solder paste stick to it or not. If nozzle tips having a fresh paste stick to it, the component might not a
Electronics Forum | Mon Mar 13 04:49:59 EST 2006 | Fhail
Hi All, I'm new in PCBA process. Recently in my leadfree production we encountered a missing ring on some of the ring on the board after we ran hem through Wave soldering machine. The board has gone through double reflow prior to the Wave soldering.
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Mon Jul 18 09:35:42 EDT 2005 | stepheniii
If it were other machines I would suggest the possibility of air kiss blowing the solder away, but mydata's have a release to make sure the air kiss never gets too high. Unless it is not pointing 90 degrees away from the machine like mydata recommend
Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron
Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
