Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Tue Jul 24 07:57:55 EDT 2007 | davef
It sounds like the QFN component is not solderable. * Use ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * Contact your QFN component supplier for help * Consider a more active flux, since you might
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Fri Jul 27 08:49:35 EDT 2007 | cman
We are currently have failures on one of our QFN > components. We are running this product with > lead free paste, lead free boards and lead free > parts. They have done a pull test on this > component and it showed that the solder joint > mai
Electronics Forum | Tue Jul 24 07:15:16 EDT 2007 | james
We are currently have failures on one of our QFN components. We are running this product with lead free paste, lead free boards and lead free parts. They have done a pull test on this component and it showed that the solder joint mainly dissconnect
Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef
Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board
Electronics Forum | Wed Feb 08 11:55:28 EST 2006 | dany
Hi all, we are manufacturing smt components and some weeks ago our customers are facing many problems related to weeting and solderability. I know it is due to the Lead free processes, but anyway, we are quite confuse. In case it was possible, what c
Electronics Forum | Thu Feb 09 08:34:07 EST 2006 | davef
If your component meets ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires, then the problem is at your customer's operation. If the problem is at your customer's operation, it's very difficult to anal
