Electronics Forum | Fri Apr 16 11:51:26 EDT 2010 | shawnvike
Looks like a simple variance in the solder mask discoloring. Shawn
Electronics Forum | Fri Apr 16 23:33:41 EDT 2010 | isd_jwendell
If you are trying for a nice reflective surface you will get a white with better spectral reflection if you paint with an appropriate formula after the board is soldered.
Electronics Forum | Fri Apr 16 12:47:48 EDT 2010 | boardhouse
White solder mask does have a tendency to yellow within the lead free environment. so double coating will not help any. I due believe the flux is a factor in the yellowing but due to the color is the main reason. Find out what brand of S/M mask they
Electronics Forum | Fri Apr 16 13:22:48 EDT 2010 | stepheniii
Have you tried running a few bare boards through the oven? If there is no flux on them and you still get the "stains" then I think you can eliminate the flux as the cuprit. And I've been told that white is the second most difficult solder mask colou
Electronics Forum | Wed Jul 27 17:18:07 EDT 2005 | Carl
Any issues in your experience using SAC305 for reflow and SN100C for wave on ENIG pcbs? I've seen the CD, but there's not much specific data regarding ENIG pcbs Thanks
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc
>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,
Electronics Forum | Wed Apr 06 15:28:04 EDT 2005 | patrickbruneel
Soldering PTH in reflow makes the process a lot more dependent on the physical forces in soldering (capillary force vs. gravity). Reducing the topheat in your oven will help the capillary forces (opening the hood solved the problem). Heat rises so if
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
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