Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh
Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an
Electronics Forum | Sun Sep 12 08:30:29 EDT 2004 | davef
Well, another alternative is to use a water washable flux. If you insist on staying with a NC flux, use one that is probable. We prefer to probe solder, rather than copper.
Electronics Forum | Mon Sep 27 11:40:50 EDT 2004 | grayman
use water soluble solder paste is the cure for your problem. but if you insist of using NC change your pogo pins to pointed pins.
Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ
Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ
Electronics Forum | Tue Sep 14 08:14:07 EDT 2004 | Rob
Hi, There are "Fluxbuster" or "Rotator" pins on the market - we had to use them a few years ago on a flexy board (with OSP). There is some info from one source at the following link: http://www.isiconnectors.com/mfrs/idi/idipr.htm#Rotator We got
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Wed Jul 17 08:26:14 EDT 2002 | davef
Search the fine SMTnet Archives to get started.
Electronics Forum | Thu Jul 18 02:08:37 EDT 2002 | computer
Thks for the advise.
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
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