Electronics Forum | Mon Dec 22 12:49:19 EST 2003 | Marc Simmel
The boards are vacuum packed in quantities of 50 pieces and used within an hour or two of opening; no nitrogen storage. The boards are processed in a double-sided smd process.
Electronics Forum | Wed May 27 11:54:29 EDT 2009 | allwave
Armando, Make sure chip wave is pumping evenly across. These TD machines require a lot of maintenance (deep cleaning)to ensure all the holes on nozzle are open... My two cents, George
Electronics Forum | Fri Nov 17 19:28:36 EST 2006 | rob@spinpcb.com
What kind of board finish do you have? You describe solder bubbles...and when you remove them, you find open vias. Are you, by chance, discovering flux contained in these bubbles? We've been experiencing the same thing with pb-free soldering on a
Electronics Forum | Wed Jan 12 16:11:26 EST 2005 | russ
I have seen the solder shoot out at least 4"-6" from both the leading and trailing edge when this happens. If the open pockets are real deep you may want to use a turbulent/chip wave for soldering, sometimes this leaves bridges however.
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Fri Jul 31 02:59:52 EDT 2009 | dj_jago
I can't open the picture but if it is webbing and you are running with an alcohol based flux (non VOC free) another thing to check is the Specific Gravity.
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
