Electronics Forum | Wed Jul 20 14:56:29 EDT 2005 | CLampron
The mount plane is not the same every time. Our machines are conveyorized and the bottom rail is fixed so the mount plane does change with the board thickness. The stand alone table has a V notch for holding the board with the flat edge on the bottom
Electronics Forum | Thu Apr 11 10:14:05 EDT 2002 | BTaylor
We use the ASC vision master 212, our customers wanted a height and volume measurement rather than an inspector doing a visual. We have added this machine to our process, checking height on many preprogrammed locations then this generates a X bar and
Electronics Forum | Mon Aug 14 15:09:14 EDT 2017 | charliedci
In my experience, in a temperature/humidity controlled environment, 1 hour, no big deal. 4 hours still ok. Overnight your pushing the limits but will probably reflow without issues. Any longer, could be a problem. Again, a lot depend on type of past
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Tue Jul 19 05:16:34 EDT 2005 | aj
Hi, I looked at the pictures and it looks as if it should be a straight forward solution..but obviously not. I would focus on the stencil/print more than placement machine. The placement machine simply places the part on the board!#(just one thing
Electronics Forum | Tue Dec 11 19:48:37 EST 2007 | arun2382
Hi, If I were working with a 75 um thick stencil, Is there a spec. as to what the maximum value allowed on actual solder height measurements? Stencil type: Laser cut and electropolished Solder paste type: Type 4 Sn-Sb Would the measured values va
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
