Electronics Forum: solder paste (Page 632 of 660)

No Clean for BGA's

Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske

Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave

Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul

Skewing of parts

Electronics Forum | Tue Jul 20 12:49:38 EDT 2004 | mmjm_1099

We are having a problem with our Heller 1800W oven with certian parts skewing. It seems that some inductors and taller Can caps are shifting around in the oven. It seems it will solder fine and than all of a sudden just be off to one side or the othe

Paste in hole (sate of the art)

Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach

We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy

5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi

Pick and Place Rivet

Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost

that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that

Need low cost pick and place machine for limited production

Electronics Forum | Tue Aug 18 22:22:43 EDT 2009 | comatose

Assuming you want to run 8 hours a day and 5 days a week, you need a sustained throughput of 2.5k components per hour. With fine pitch, futzing around, setup, etc you should really look for machines rated in the 4k to 5k per hour range. That's not sc

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob

It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Re: Apply glue with a stainless stell stencil

Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh

First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one


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