Electronics Forum: solder paste application (Page 1 of 743)

Electrically-Conductive Tapes application advice?

Electronics Forum | Fri Jul 31 17:17:12 EDT 2009 | isd_jwendell

If the sensor can survive the 200C in the molding machine, then could it not survive Pb-free soldering? Maybe not convection reflow, but it should be able to survive vapor-phase reflow. I would control solder height by controlling the amount of paste

Electrically-Conductive Tapes application advice?

Electronics Forum | Sat Aug 01 04:45:43 EDT 2009 | hohk

Thanks on the advice isd.jwendell! Yes, the piezo ceramic has a Curie Temp of about 800C, so its safe operating temp should be around 300-400C. How about if my PCB is a prototype, would it be more economical to use hand soldering or just manually app

Electrically-Conductive Tapes application advice?

Electronics Forum | Sat Aug 01 12:06:52 EDT 2009 | isd_jwendell

Unfortunately, I don't see any image. If your part will survive 300C then even convection reflow should work. The use of paste and reflow ovens are for when you move to production quantities. It sounds like you could hand solder your prototypes (proo

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

High frequency application V.S no clean flux

Electronics Forum | Mon Jul 08 03:09:12 EDT 2002 | Benny

Hi all How can I find the technical paper or source of information about using No-clean flux with high frequency apllication. High frequency mean more than 2 GHz - 5 GHz. I heard from my colleague that No-clean flux residue on board effect to high

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:24:02 EDT 2005 | patrickbruneel

Yes a No-Residue solder paste exist. email me for more info Pat

High frequency application board V.S rework CSP

Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben

Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 10:46:27 EDT 2005 | lyrtech

Hi, I curently have an interesting challenge. But I don't have all the knowledge to solve it. One of our boards is used in RF applications. We noticed that the No-Clean flux residue makes interferences in the RF signal. Removing the flux residue so

Type 4 solder paste

Electronics Forum | Tue Apr 20 13:22:28 EDT 2004 | Kary Voegele

Transistion Automation makes a great squeegee blade. I have found that it is superior to the standard steel/titanium blades generally used in production. It is made from gun barrel blue steel. It is more expensive than standrd squeegee blades, but i

WS619LF solder paste

Electronics Forum | Thu Feb 07 05:24:16 EST 2008 | muarty

I would advise that you clean the stencil thoroughly at least every 4 hours, also though it is worth cleaning the stencil top and bottom after any breaktimes. To avoid solder paste drying off in stencil apertures. Best piece of kit I've purchased was

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