Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman
You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
Electronics Forum | Tue May 03 07:08:41 EDT 2022 | SMTA-64386201
We do have a CyberOptics SQ3000 that is currently only used for AOI, but I hope to start doing sample 3D SPI with it soon.
Electronics Forum | Mon Mar 07 15:03:57 EST 2022 | emeto
I wish traceability was not part of our job. If I have to pick, I will laser etch barcodes rather than use labels. Small footprint and fine pitch parts will always hate the label when you print paste. Pick thinner labels, keep away from problematic l
Electronics Forum | Thu Jan 04 17:26:17 EST 2001 | Cory
We're going to begin conformal coating a few of our assemblies as required by our customer. We're using Kester No clean paste and will use cotton gloves to keep the boards clean while handling. My question is: Do we need to clean the boards prior to
Electronics Forum | Fri Dec 11 09:51:56 EST 2009 | dyoungquist
I won't say never but very rarely do we have problems with the flux seperating. The way we get around the 1-2 hour warmup time is this: The day before we run a particular job, the last person takes out the paste needed from the fridge as the last t
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
