Electronics Forum: solder paste collapse (Page 1 of 666)

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 10:21:06 EDT 1999 | Earl Moon

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

BGA collapse during reflow

Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Air inclusion in solder paste

Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms

Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid

solder paste

Electronics Forum | Thu Dec 10 09:06:47 EST 2009 | stepheniii

Just how cold do you store your paste? And what are your solder paste reps like? Here they fall over each other giving support for their paste. And have you seen the problem with flux separation or have you only heard about it?

solder paste

Electronics Forum | Tue Dec 08 08:52:42 EST 2009 | cunningham

How do people prepare there solder paste for screen print? We currently remove them from the fridge and mix them in a 500g solder paste tub mixer to mix the flux and paste together we waste to much paste at the moment as we only use the tub for 1

solder paste

Electronics Forum | Mon Dec 14 18:45:08 EST 2009 | gregoryyork

why not use a paste where it requires no refrigeration at all cheers Greg

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