Electronics Forum | Tue Jul 13 16:19:05 EDT 2004 | Inspection Solution
Hi Mark, There are many tools available for measuring solder paste height. Most machines use laser as the basis for inspection while others use structured white light. If simple height and width inspection is all that is required, you can look int
Electronics Forum | Tue Dec 08 08:52:42 EST 2009 | cunningham
How do people prepare there solder paste for screen print? We currently remove them from the fridge and mix them in a 500g solder paste tub mixer to mix the flux and paste together we waste to much paste at the moment as we only use the tub for 1
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Tue Jul 19 12:03:34 EDT 2005 | cyber_wolf
CLampron, There is no place for PCB thickness in a Mydata program. The board thickness is of no consequence.(As long as the thickness is uniform across the entire board) When you run a program, the Z axis touches the surface of the board to determin
Electronics Forum | Tue Jul 19 09:45:51 EDT 2005 | cyber_wolf
I have seen this problem on Mydata machines before. I am very sure that your missing paste is being caused by the placement machine. Check these things : 1. There is a small white check valve on the pressure side of the vacuum pump. Make sure it is
Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Mon Aug 10 22:18:02 EDT 1998 | Steve Gregory
I am trying to get an idea of what system seems to work best for >solder paste inspection. I am looking for basic table top >models with he capabilites of height and width measurements. >Can anyone give me suggestions, pricing and why you prefer on
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Tue Mar 13 12:54:58 EDT 2007 | hynergy
You required the process control equipments. 1) Paste Height Checker: To measure the solder paste thickness after printing. 2) Temperature Profiler: To measure the reflow oven temperature whether is within the control spec.
