Electronics Forum | Mon Mar 02 09:45:08 EST 1998 | Justin Medernach
| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Mike,
Electronics Forum | Thu Mar 17 09:56:34 EST 2005 | jmedernach
Tx, Your spec limit is the point at which you expect to see a failure. In other words, what is the probability that you'll see a short when you have .008" of solder paste? What is the probability that you'll see an open if you have .004" of solder
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon
Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Tue Apr 27 16:21:09 EDT 1999 | Chrys Shea
| Another basic soldering question. I notice that lead-free solders have become required for plumbing applications due to legislation. In a local hardware store, I noticed the existence of lead-free solders (based upon tin-copper I think) with a me
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