Electronics Forum | Thu Jan 15 10:33:05 EST 2009 | rrpowers
One thing you must be very careful with when using Bismuth is that there is no lead anywhere else within the process, either components or boards. Lead-terminated components or hot air solder leveled (HASL) finished boards used in combination with a
Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Fri Dec 18 06:08:14 EST 2009 | fönsi
I measured the diference soldering the TC to the pad and just tape down it, because i had a trouble with accuracy of some TC's. For the TC's I just taped down, I used additional heat-conductive paste to make a a termal connection from the TC to the s
Electronics Forum | Mon Jan 11 13:40:16 EST 2010 | cbart
are you seeing this post processing or are they coming back from your customer or field? Have you tested raw boards and raw parts to see if there are issues with either? do you have x-ray equipment? if back from the field and they had past your tes
Electronics Forum | Mon Apr 26 03:04:15 EDT 2010 | grahamcooper22
I always fix thermocouples to pcb pads across its width. Then rotate it 180 degrees to check readings. If I am happy that the oven is giving results within a few degrees C then I'll crack on and set up a soldering profile. I am not sure what the oven
Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364
Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s
Electronics Forum | Mon Aug 29 21:36:39 EDT 2011 | davef
We agree with JAX. Changing the pads on your board as you describe won't do shit. Possible solutions to a cold solder connection problem include: * Raise the peak temperature to be high enough to reflow the material thoroughly. * Select a solder pas
Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Sat Dec 08 00:09:24 EST 2012 | jlawson
Mentor(Valor) has dfm softwares that not only looks at the stecnicl layers buy can look at other impacts that could effect the optimisation of the stencil design, ie solder mask layer tolerances defined from fabricator-design etc - this is a upper en
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