Electronics Forum: solder paste koki brand overdue (Page 1 of 1)

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp

Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c

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