Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Thu Dec 10 09:06:47 EST 2009 | stepheniii
Just how cold do you store your paste? And what are your solder paste reps like? Here they fall over each other giving support for their paste. And have you seen the problem with flux separation or have you only heard about it?
Electronics Forum | Wed Dec 09 03:34:06 EST 2009 | cunningham
Sorry i wasnt very clear we already have a Malcolm sps-1 for our tubs but to move over to cartridges we need a machine to do that none of those machines are capable of mixing a 6 oz cartridge
Electronics Forum | Tue Dec 08 08:52:42 EST 2009 | cunningham
How do people prepare there solder paste for screen print? We currently remove them from the fridge and mix them in a 500g solder paste tub mixer to mix the flux and paste together we waste to much paste at the moment as we only use the tub for 1
Electronics Forum | Thu Jul 28 07:23:24 EDT 2011 | scottp
My group supports a couple hundred lines all over the world. Most of them use squeegees but a few use either the MPM Rheometric pump heads or the DEK Proflow heads. I absolutely hate the enclosed heads. Flux separation, compaction, and the print q
Electronics Forum | Fri Mar 29 07:19:32 EDT 2019 | jacoblemaster
I am still in confusion what does it mean? I simply have a heat pump which is the part of the HVAC in my home. It is not used over here I supposed.
Electronics Forum | Fri Sep 25 16:38:56 EDT 2009 | esoderberg
empf issued an excellent study of calculated solder volume in the 90's. It used lotus 123 but is easily used in excel. I have used it for over 10 years. The only thing wrong is with leadless components. the amount of paste required generally is insuf
Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark
I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Fri Apr 27 11:24:53 EDT 2007 | realchunks
Hi Steve-O, Good question(s). This process was set-up by an engineer that had a PhD in statistics, took him a year to develop and then thru it over the wall at us. The biggest problem we saw was SPC to measure solder volume. SPC is good for measu
