Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
Electronics Forum | Fri Jul 10 10:40:13 EDT 1998 | Todd N
Hi all, We are currently having problems with a laser-cut stencil that is electropolished and nickel plated with 9-mil openings. The paste does not release well from the apertures. We are having to wipe after every print. The board is fixtured well a
Electronics Forum | Sat Jul 11 06:56:35 EDT 1998 | Tom Denison
| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu
Electronics Forum | Sat Jul 11 06:56:03 EDT 1998 | Tom Denison
| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Tue Aug 14 19:47:02 EDT 2012 | kahrpr
If you need cycle times less than a 60 sec this is not the machine. If its a real dense board and big it can take up to 10 minutes. It can miss pads so you have to use the inspect and that is what eats up time. The machine will re-paste any missed sp
Electronics Forum | Thu Aug 05 05:23:13 EDT 2004 | Bryan
Hi All,per my understanding ,the fail mode is the heel fillet of QFP seems no good,right?If yes...I think..we should:1.increase the aperture length on stencil and make sure there's enough solder paste on pad before reflow. or you can increase your t
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
