Electronics Forum | Wed Jul 20 05:49:45 EDT 2011 | kenneth0
I think you are referring to nano coatings. Try google nano coated stencils
Electronics Forum | Tue Jul 19 14:33:17 EDT 2011 | ccouture
Has anyone tried using a product thet when applied to a stencil, it facilitates the release of solder paste from the stencil, including the fine pitch openings. It makes the stencil's surface "fluxophobic". Same principle as Rain-X for windshield. A
Electronics Forum | Wed Jul 20 13:02:48 EDT 2011 | markhoch
I just asked the same question a few weeks ago. Here's the link to that thread: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=15684&mc=3
Electronics Forum | Fri Feb 05 09:40:45 EST 2010 | denisp
Hi! i would like to have opinion about the solder paste release. is it better on a 5mil or 6 mil thickness stencil? thank you!
Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef
The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.
Electronics Forum | Thu Feb 10 09:14:09 EST 2005 | davef
Don't kid yourself, something has changed. * Worn stencils should produce better release and greater paste deposits than less worn stencils. * Consider inspecting the effectiveness of your cleaning process with a X10 magnifier. * Temperature in your
Electronics Forum | Fri Feb 11 00:22:05 EST 2005 | Grant
Hi, That's what I am thinking, and we might have a dirty stencils and cannot see the problem. We are going to get a magnifier, and check it out. I did not think the stencil could bur, but I didn't want to shoot the guys down when they had an idea on
Electronics Forum | Wed Feb 09 21:41:49 EST 2005 | Grant
Hi, We have been running the same stencils for about a year, 5 thou thick, 1-mm pitch BGA's and every-things been ok, but then suddenly over the last week, 2 different products have had paste release issues with the BGA. It's odd because nothings c
Electronics Forum | Thu Dec 19 16:15:26 EST 2002 | Dreamsniper
Hi Grant Petty, I read about your problem, You might have problem with the design. First on the pad. What is the diameter of the BGA pad in your PCB. We have the same size of PCB and we use 0.584mm Pad dia. and a 10% reduction on our aperture. We us
Electronics Forum | Wed Dec 18 08:19:00 EST 2002 | cyber_wolf
One thing that will also cause this is very slight stencil mis-alignment. Sometimes the paste will have a tendency to hang up in the apertures if you are over hanging just a little on the solder mask. Some solder mask are very slick and will not pull
