Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Sat Aug 07 04:11:57 EDT 2004 | AOI Solution
This is Ivan from TRI USA located in Santa Clara, CA Our company provide a Solder Paste Inspection System which uses 635 Line Laser to scan the panel and come out a real 3D height, area and volume measurement! We sold lots of this system in Asian EMS
Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe
Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold
Electronics Forum | Sun Jul 29 08:36:39 EDT 2001 | davef
You have provided very little information. Two similar possibilites come to mind: poor pad solderability protection and old boards. POOR SOLDERABILITY PROTECTION: Maybe the nickel plating under the gold is oxidized, contaminated, or otherwise very
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Wed Jan 20 22:46:44 EST 1999 | Bernie
Thanks for the info. I modified the stencil, ran the boards, and just got a new stencil. Life is good again. Bernie | Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the boa
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Tue Jun 05 22:18:47 EDT 2001 | Dreamsniper
I don't understand why you wanna do this. The vendor has done this part for you and actually they have a recommended glue / solder paste life on the stencil or pcb (e.g. 6 hrs, 8 hrs.). If you will stick with their recommendations you won't be lost p
Electronics Forum | Thu Jul 20 13:08:35 EDT 2000 | Bob Willis
The solder paste formulation is different 63/37 is a tin lead alloy so t here is one difference from a lead free. Yes you can get no clean lead free products but if you compare the amount of visible residues they will be normally higher. So far most
