Electronics Forum | Tue Jul 08 07:01:40 EDT 2003 | davef
Try: * ANSI/J-STD-004 - Requirements for Soldering Fluxes * ANSI/J-STD-005 - Requirements for Soldering Pastes * ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering App
Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Tue Apr 12 08:25:43 EDT 2005 | davef
Q1 Can anyone explain to me what is the clean and non clean solder? A1 The trend away from CFCs has lead many users to evaluate switching to no-clean soldering processes. The term "no-clean" is actually a common misnomer when used to describe a flux
Electronics Forum | Thu Jul 15 04:33:56 EDT 2010 | jevans
We've recently purchased a second hand smt line which contains an Ersa Hotflow 9 reflow oven.We were informed that this oven was capable of handling a lead free process.The oven was manufactured in 2000,and it has come to our attention that it can on
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Sun Sep 17 09:02:53 EDT 2006 | davef
Just as you will not find such a specification for SnPb solder, you will not find such a standard for SAC. We talked about solder strength several times previously here on SMTnet. Search the fine Archives for others comments. For instance: http://
Electronics Forum | Sun Sep 17 02:48:41 EDT 2006 | Eric
Anyone know any international standard (e.g. IPC, JIS) for the SAC lead free solder strength ? If no, any industrial / company standard for it ? Besides, any mathematical model which can help to calculate it.... express in "Force / area "
Electronics Forum | Wed Feb 23 15:06:05 EST 2005 | Zlatan
Would you be able to share with me, what specific abnormal chemical reaction could happen? Thanks
Electronics Forum | Tue Apr 13 14:56:51 EDT 2004 | russ
in a thread titled ".5mm bga" there is a reference to a paste by alpha that is no-clean and is supposed to be made specifically for this situation. I suppose that increasing the pad dimension to .012" is out of the question? Russ
Electronics Forum | Fri Jan 28 04:03:51 EST 2011 | grahamcooper22
Print then dispense in the areas you need extra paste. Why can you not use a stencil which has areas etched away around component patterns to thin the stencil down....for example a 150 micron thick stencil etched to 120 or 100 microns in specific are
