Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ
Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ
Electronics Forum | Sun Sep 12 08:30:29 EDT 2004 | davef
Well, another alternative is to use a water washable flux. If you insist on staying with a NC flux, use one that is probable. We prefer to probe solder, rather than copper.
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Fri Mar 31 13:59:21 EDT 2017 | westshoredesign
Need more information. BUT if your strictly considering just the paste change. I would imagine your changeover would be little to no different than changing to the second board if you were using the same paste. Maybe take extra care cleaning your sq
Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef
First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
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