Electronics Forum: solder paste stencil separation (Page 1 of 184)

MPM AP25, separation problems

Electronics Forum | Mon Oct 31 03:42:47 EST 2005 | pavel_murtishev

Good day, Problem appears only with 0.5mm pitch components. Print quality for these components is unacceptable. Paste type isn�t new for us. No any tape on the bottom of the stencil. We apply enough pressure on squeegees, stencil remains clear after

MPM AP25, separation problems

Electronics Forum | Wed Nov 02 08:16:31 EST 2005 | pavel_murtishev

Hi! It goes away only for one or two print strokes. After them the problem arises again. After first print stroke I inspect a lot of �dog ears� and a lot of paste not released from the stencil (it�s not a stencil design problem, other machine prints

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 09:27:36 EDT 2005 | russ

havfe you tried all paste manufacturers? Dog ears are usually from a little sticking to the aperture walls. this is usually the result of stencil design and or table seperation speed.

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 10:04:02 EDT 2005 | valuems

Hello Since we have a few years experience with these printers we might be able to help. Is these problems always with the same components? Is this a new type of paste for you? Is there tape on the bottom of the stencil? And how much pressure do

solder paste stencil life

Electronics Forum | Sat Dec 15 06:34:54 EST 2012 | sowmya

Normally paste manufacturer specifies stencil life of a paste is 10 hours. the question is, if i run a continuous manufacturing for 40 hours, we will be adding 250 g of paste for every two hours. The addition of 250 g will be mixed with the paste whi

solder paste stencil life

Electronics Forum | Mon Dec 17 09:38:27 EST 2012 | cyber_wolf

Why scrap paste if there is no degradation of performance? Do your own study to determine this.

solder paste stencil life

Electronics Forum | Mon Dec 17 08:34:58 EST 2012 | emeto

I would scrap it. As you said part of it is going to be old paste. All manufacturers don't recommend mixing old with new paste because you change the rheology of the paste.

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

solder paste release from stencil

Electronics Forum | Tue Jul 19 14:33:17 EDT 2011 | ccouture

Has anyone tried using a product thet when applied to a stencil, it facilitates the release of solder paste from the stencil, including the fine pitch openings. It makes the stencil's surface "fluxophobic". Same principle as Rain-X for windshield. A

solder paste release from stencil

Electronics Forum | Wed Jul 20 05:49:45 EDT 2011 | kenneth0

I think you are referring to nano coatings. Try google nano coated stencils

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