Electronics Forum | Mon Dec 06 16:54:38 EST 2004 | Gopinath A
Hi, I understand that solder dipping of gold plated units (PCB or component lead) is not the ideal solderability test (leaching of gold in the solder bath being one reason). Would anyone have recommendations as to the ideal solderability tests for g
Electronics Forum | Wed Dec 15 10:37:55 EST 2004 | gopinath A
Thanks Dave, That answers my question. I didn't think either that the qty of gold in platings would be enough to contaminate the solder pot. I wanted to make sure that leach test is a valid test for gold finishes. Gopinath@mcl.com
Electronics Forum | Tue Dec 07 17:38:50 EST 2004 | davef
ANSI/J-STD-003 - Solderability Tests for Printed Boards is widely accepted. That's it, that's the list. If you email us your email address, we'll give you someone to call. Without knowing the number of boards that you plan to run across your wave,
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Thu Apr 03 22:56:48 EDT 2008 | davef
Potential impacts of using expired solder paste are [University of Bolton]: * Changed paste rheology. Result: poor print quality * Loss of solvents. Result: reduced flux activity * Changed flux formulation. Result: More difficult to clean flux residu
Electronics Forum | Tue Apr 13 13:55:46 EDT 2004 | arcandspark
I have samples coming in, AIM and ALPHA, Multicore use to have manufacturing in the same town but disappeared. Your right about getting better help fro other, Indium is the worse I have ever had to deal with. They act like I am bothering them when I
Electronics Forum | Fri Apr 04 14:54:19 EDT 2008 | alexs
Thanks for the reply. Just one more question. If there is less solvent but the residues are harder to clean. would there be more contaminant left on the boards? Has anyone did a cleanliness test?
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
