Electronics Forum | Thu Feb 23 12:17:47 EST 2006 | mafc65
As Russ say, you can buy kits from Practical components and make your tries, the send those pcb's to your solder paste vendor for analysis.I am using Senju Lead free solder and I send boards to them then they cut the board and analyze your solder con
Electronics Forum | Wed Feb 22 08:01:42 EST 2006 | INGE
We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For exam
Electronics Forum | Thu Feb 23 02:46:16 EST 2006 | INGE
It isn't an FDA validation. I think Steve has centered the problem. I have already defined all the steps and all the procedures of the process, but now I must run X boards, Y times, through each piece of equipment (as he said before); the question is
Electronics Forum | Thu Feb 23 10:49:38 EST 2006 | slthomas
Defining failure modes will help determine what you need to quantify in all processes. Personally I wouldn't pursue the DoE angle (varying setup parameters to determine robustness). 1)How about % pad coverage, paste thickness, and accuracy? Define w
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Wed Feb 22 10:32:37 EST 2006 | amol_kane
you could do a capability analysis on the printer.....setup the printer with your print parameters and select a metric (say paste volume deposited) and find out Cp and Cpk values
Electronics Forum | Thu Feb 23 11:40:45 EST 2006 | billyd
My company is looking to run some small validation cards to verify our Pb free process for potential customers. Basocally, we'd like to print a small card, place some components, say 0402 to a small BGA, maybe some thru-hole stuff, and reflow it. So
Electronics Forum | Wed Dec 15 16:17:30 EST 2010 | rgduval
Sounds like there may be a people problem somewhere in your process. We have a couple of checks set up to aid with capturing first article issues. First, of course, the kit is checked against the BOM to ensure that all of the parts match. Then, we
Electronics Forum | Tue May 31 16:52:57 EDT 2011 | xray
Hi SSager, Check out the FA Inspector. It provides 1 Automatic Detection Mode and 2 Manual Inspection Modes. Its used to automate First Article Inspection Tasks and enhance today's principally manual process using microscopes and pen and paper. T
Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip
Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are
