Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Fri Jul 09 19:35:05 EDT 1999 | Earl Moon
| Hi Carol- | What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Ca
Electronics Forum | Thu Jul 26 13:17:45 EDT 2001 | Hussman
Most solder paste manufacturers will take a reasonable amount of paste back, just so they won't loose your business due to bad paste. But if you're asking to ask to ask - separated paste from flux is not a bad thing if the jar was never opened. Pas
Electronics Forum | Thu Jun 25 21:13:11 EDT 1998 | Phillip Hunter
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Print speed is determined by your aperture dimensions, paste viscosity type of blade (metal
Electronics Forum | Tue May 02 05:59:28 EDT 2006 | davef
We agree with Ken's points about off contact / screen versus stencil, but this DHolt is talking stencil [regardless of what is typed about screens]. Comments are: * On "smears under the stencil": smearing happens. It makes us wonder about the frequ
Electronics Forum | Wed Feb 23 03:22:47 EST 2011 | pkannan
(Corrected the Subject line - sorry for Spelling ) You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t
SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
