Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach
| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c
Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin
| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Electronics Forum | Fri May 15 18:09:00 EDT 1998 | Earl Moon
| | | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | | We h
Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator
Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t
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