Electronics Forum | Wed Apr 27 22:36:47 EDT 2005 | devilhitam
is there any relation between solder paste viscosity and the length of time the solder paste being used in the machine? pls advice....
Electronics Forum | Tue Apr 19 09:09:28 EDT 2005 | russ
Here is one reason- It eliminates the viscosity change during printing operation from the paste warming up and getting thinner. I would contact your paste supplier and have them give you the full list.
Electronics Forum | Wed Apr 27 15:14:12 EDT 2005 | andymackie
The viscosity decrease on warming is one of the main reasons, but you also don't want to get moisture condensing on the surface of the paste. Activators in the paste (that are used to eliminate solderballs and enhance solderability on reflow) become
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Fri Apr 20 16:05:17 EDT 2001 | gcs
We always reduce side to side, EXAMPLE: 12 mil width reduced to .010". Do you guys check viscosity ? Also maybe your guys are appling to much pressure on the sqweegee blades.
Electronics Forum | Thu Nov 07 07:35:23 EST 2002 | cyber_wolf
If you are experiencing flux migration, try refrigerating your paste when not in use. This causes the flux viscosity to go up. I have seen flux seperate from the solder is when it is VERY old and out of date.Sometimes warmer ambient temperatures wi
Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Fri May 25 17:25:25 EDT 2001 | morefun
Is anyone out there is the contract or the OEM sections using viscometers to check solder paste or glue for acurate process definitions. By this I mean check the materials viscosity over a period of time and measure the degradation of performance, t
Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
