Electronics Forum: solder paste viscosity kcps (Page 5 of 14)

Solder paste in Syringe vs Jar

Electronics Forum | Thu Nov 21 02:43:07 EST 2002 | jate

Hi, Jar's quality is easier to measure. If you want to know paste viscosity etc. it's easier if you use jar. I have bad experiences about cartridges. I used cartridges for a short time but I change it back to jar because flux separated too easily in

super fine pitch paste & dispensing questions

Electronics Forum | Sat Aug 21 02:27:21 EDT 2010 | isd_jwendell

The paste you dispense will not solder the same as the one you use with a stencil. The paste for the stencil will have a higher metal content. I was not working with dispensing as small as you are, but after evaluating the cost of the stencil vs. lon

Printing problem, water soluble paste with gold plating PCB..

Electronics Forum | Mon Jul 30 21:12:32 EDT 2001 | davef

"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, a 6 thou stencil should be OK, providing you don�t violate the area and aspect ratios in the fi

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F

Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�

Re: Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se

| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using

Solder Paste

Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake

Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub

Solder balls

Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen

60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con

Solder Clogging

Electronics Forum | Sat Jul 03 15:14:25 EDT 2010 | scsi

Hege, can you share more info on the formulation you ended up using for the micro dot dispensing? I'm trying to find the proper metal load and viscosity for the auger valve dispenser that we are developing and it looks like the regular low viscosity

Solder balls

Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim

Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to

Solder balls

Electronics Forum | Sat Jul 03 08:52:19 EDT 2004 | davef

Q1: What's the difference between static and dynamic viscosities? A1: Static viscosity is the viscosity of the solder paste as it is dispensed off of a tube or syringe onto a screen printer. Dynamic viscosity gives the variation in the thixotropic b


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