Electronics Forum | Thu Jan 03 02:26:12 EST 2002 | arzu
Hello, I need to know the volume spread of solderpaste after screenprinting fine-pitch paste using a nickelformed screen. It is the end-result that counts , so of course the spread of metalcontent in the paste is important too. Can anyone tell me som
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Tue Oct 26 16:51:18 EDT 1999 | John Thorup
Hi nards I'm not quite sure what your question is. If you mean is paste volume more important than the reflow profile the answer is no. Belt speed is just a part of creating a reflow profile and all aspects I.E. pasting, placing and reflow are jus
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed Sep 26 12:16:44 EDT 2012 | bwjm
Hi Guys,recently i am facing an issue. Refer to the attached photo. This PCB is high RF speed, gold immersion single layer. After reflow, my solder seems to have black stains on it. I tried with SAC305 paste water soluble and no-clean, both results a
Electronics Forum | Wed Jun 01 03:49:30 EDT 2005 | devilhitam
I'am having a problem with 0805 component where right after placement, the component tend to move from the pad. I'am using 'horse shoe' aperture for 0805 component to resolve the solder beading issue. Does this 'horse shoe' contributing the skew/shif
Electronics Forum | Thu Apr 26 10:07:06 EDT 2007 | realchunks
Hi Dub J, I have worked for a few companies that did 3D sampling and found the data they produce to be useless. In the real world they are slow, so that means you won't sample every board. Now if you're not sampling every board, and you start to r
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Sun Feb 06 12:59:33 EST 2005 | GC
Please try to use 6-8 mils ..you are overloading pads surface ..Please verify paste volume vs surface..Have fun
