Electronics Forum | Tue Feb 10 17:38:22 EST 2015 | mbartel
low volume high mix, looking for advice on what i should get, a stencil machine or a jet printer for smt solder paste. used/new and companies i should look into?
Electronics Forum | Wed Feb 11 13:37:37 EST 2015 | cyber_wolf
I can buy approx 1000 stencils (cost includes next day delivery) for the price of a MY500. With a stencil, I can use WS paste and any other paste for that matter. The MY500 only jets certain paste from specific manufacturers. It is VERY VERY rare th
Electronics Forum | Wed Jun 06 02:59:11 EDT 2018 | buckcho
Mr. Evtimov, Koh Young and Parmi have this option in their SPC software. You can also choose either Volume, Area, position, height (both in um or %). Here is a screenshot from Parmi. Unfortunatelly i cant find my old Koh Young screenshots. Parmi has
Electronics Forum | Wed Feb 11 00:34:42 EST 2015 | comatose
There isn't going to be much worthwhile used equipment out there if you mean true jetting - it is a pretty recent process. There are lots of used stencil printers out there, so from an up-front cost perspective, stencil wins. Jetting is slow. A hig
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Sat May 29 06:07:16 EDT 2021 | rsatmech
Thanks, I do observed more solder paste terms of percentage in 0.06mm stencil than in 0.08mm stencil.
Electronics Forum | Fri May 21 15:57:08 EDT 2021 | emeto
The thinner the stencil the bigger the variation in terms of percentage. Most probably it was experimentally established, rather than calculated.
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
