Electronics Forum | Tue Apr 13 17:48:54 EDT 2004 | davef
Q1: Can anyone explain to me about the effect of their mixture. A1: What is their �mixture�? Q2: What enhancement does my BGA will have when using a WS paste flux with regards to corrosion, 25 years life cycle of the solder joint. A2: Tough to say
Electronics Forum | Thu Sep 05 18:15:15 EDT 2002 | pjc
There are chemistries out there that will solublize some post-solder NC flux residues. I have had success with Zestron material Vigon A200 and Petroferm material Hydrex DX. Go to http://www.zestron.com and http://www.petroferm.com These are chemical
Electronics Forum | Wed Jun 16 13:25:09 EDT 2004 | russ
have you tried a more agressive flux like water soluble to see if the problem goes away? Or can they be hand soldered with no problem? I am basically out of ideas other than a bad nickel or tin finish. The reflow profile didn't seem out of whack f
Electronics Forum | Tue Sep 14 13:36:56 EDT 2004 | C Lampron
Hi Simon, I would recommend a thermal profile on a BGA that is mounted directly over another one. The best way to accomplish this is to drill through the first side BGA to just break through the second side. (assuming you have a board that you can d
Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu
We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe
Electronics Forum | Mon Feb 13 22:37:40 EST 2006 | KEN
Cleaning no-clean is the pitts. If cleaning required migrate to water soluble. Can IPC help here? No cleans only need to be removed per IPC if the joint inspection is inhibited...and in general if form-fit-funciton is not achievable. But then th
Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax
Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility
Electronics Forum | Thu Oct 05 12:10:36 EDT 2017 | duchoang
Thank you for your replies. We use No-Clean Paste and some customers do not want any residue left around solder joint even so, so little. They want the residue washed completely. If we use water-soluble flux, we still need to wash, anyway. Their conc
Electronics Forum | Fri Jan 04 09:34:45 EST 2019 | ameenullakhan
Hi , thanks.. yes you are right.Its bot and top side. Decreasing the lower heaters and increasing the top heaters for secondary side. will this matter in convection reflow ovens. Since the heat at the end will get equally distributed. We were s
Electronics Forum | Tue Apr 13 20:57:14 EDT 2004 | Mike Konrad
Hey Dreamy, Dave is correct. If you attempt to clean your water soluble (OA) flux with water only, you will turn the no-clean flux white. No inspector or end-user will accept this. If a proper cleaning system is not available to you, then I would
