Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy
The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh
Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy
5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi
Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory
Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc
Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES
| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Fri Oct 01 04:03:31 EDT 1999 | Brian
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt
Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a
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