Electronics Forum | Fri Nov 19 10:14:30 EST 2004 | steve
A customer of mine is having problem. They can't control their humidity. It is very dry. RH averages 28-30%. The water soluble solder paste prints great. But dries out on metal squeegee. Any suggestions.
Electronics Forum | Fri Aug 04 09:09:22 EDT 2006 | russ
Aj is right, utilize the homeplate aperture, this reduces the amount of paste actually underneath the component, Pb frees exhibit this mid ship more often than the lead, I think,it is mostly because of thre transition to noclean form water solubles
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Sun Apr 18 07:01:10 EDT 2004 | Nick Prince
"Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux." This statement is confusing me (not to difficult at my time of life)
Electronics Forum | Thu Mar 20 10:57:28 EDT 2008 | patrickbruneel
In addition to Dave�s comments RE: Stands for RESIN (purified or modified rosin) No resin can be cleaned with pure DI water (requires saponification). L0: Stand for halide free activation which can safely be left on the boards. To my knowledge all
Electronics Forum | Sat Feb 19 10:27:38 EST 2011 | kahrpr
Just a thought. What is the real shelf life of the past? Do manufactures low ball the self life to sell more paste. If the past is perfectly good one day before the expiration date is it still bad one day after I doubt it. Right or wrong I have seen
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs
I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?
Electronics Forum | Thu Feb 27 13:50:55 EST 2003 | Matt Kehoe
We use an Aqueous Technologies Millennium III closed loop system. The footprint is no more than 12-13 feet. We wash water soluble solder paste residue with excellent results however, due to the nature of our solid solder deposit process, we are washi
Electronics Forum | Fri Aug 19 06:49:27 EDT 2011 | leadthree
I got this MQFP-144 and the soldering looks always very flimsy. I think I use a suitable leaded paste (water-soluble) and the stencil thickness is also OK. The IC on the image looks a bit shifted, that's not the problem. The problem is rather that
