Electronics Forum | Wed Jul 17 10:44:19 EDT 2013 | gregcr
Hi All, Has anyone seen or used equipment that is capable of automating the process of attaching hookup wire directly to a large SMT pad? Soldering, ultrasonic? I'm looking to see if there is a machine that is capable of automatically taking a tef
Electronics Forum | Wed Jun 18 07:49:06 EDT 2008 | more_sunshine
hi i'm not experienced in creating pcbs but i have good background, and i have a bunch of questions. i have no access to world wide known pcb chemicals but i managed to get a cramolin positiv spray and i don't know if it is still usable or not? (di
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Tue Sep 24 12:30:11 EDT 2002 | Claude_Couture
I'm just shooting ideas here, but maybe a via hole in the middle of the solder pad would drain the excess solder by capillary force? Or using a tin plated PCB and printing flux only, then place and reflow. depending on the thickness of the tin plati
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Thu Feb 27 02:55:53 EST 2020 | hexton
I want to avoid peoples preferences as they will differ and will not be a deciding factor. A heat gun will introduce risk to surrounding PTH components and having to add protection for those, will limit any gain in productivity. There is no question
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Tue Feb 25 06:06:11 EST 2020 | hexton
I am currently weighing up my options for resistors that will be fitted to a fully assembled PCB (PTH&SMT). Do I omit the stencil apertures leaving exposed pads (ENIG) so they can be hand soldered with fresh solder. Considering shelf life for soldera
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
winsouce.jpg)
.gif)
