Electronics Forum | Wed Nov 20 01:38:53 EST 2019 | ajspec
Hi, i'm facing solder mask peel off but limited to the solder defined pad only(opening area). no peel off on the other area and it happened on electroless nickel immersion gold finishing only. for other finishing is not affected. kindly advise if you
Electronics Forum | Wed Dec 11 11:26:25 EST 2019 | SMTA-Norah
Yes, a polite complaint to our board shop later and the next batch didn't have that problem at least. I'm not convinced it's an ENIG issue as there was variability panel to panel in the first place.
Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy
I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look
Electronics Forum | Tue Jul 14 15:21:28 EDT 1998 | Brian Conner
| We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the par
Electronics Forum | Wed Oct 13 14:27:08 EDT 1999 | mikeh
Dave F, We are currently using a latex based ambient/thermal cure material that is applied by hand or automated dispensing equipment. Printing is an option for us, but we have not had much luck with this particular material. The mask is peeled off a
Electronics Forum | Thu Jul 27 12:09:41 EDT 2000 | JohnW
Jason, where on the board is your connector?, front / back / middle? and where it on the PCB that you don't have issues with? Thief pad's are basically dummy pad's taht you have after the last set of pin's on the component are are used to draw the
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Fri Apr 21 14:58:04 EDT 2023 | rgduval
I mean...there are a ton of possibilities for bridging on selective solder before you ever get to alloy purity. Are the bridges happening consistently in the same spot? Are the leads too long? Can you modify the approach/exit/peel off to address? Wh
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
