Electronics Forum | Fri Aug 26 21:23:38 EDT 2005 | Jes�s Salinas
Hello , In our case we take the results from the repair station. Each test station has its own repair station so from there we count the process defects : placement and printing. The formula used to calculate PPM = DEFECTS / (PARTS PER BOARD x UNITS
Electronics Forum | Sun Aug 14 22:58:17 EDT 2005 | crishan
Hi All, I would like help in establishing what is a feasible PPM reject rate from a typical SMD line. As a reference an SMD line consists of, solder paste printer, chip component placement, pick and place IC components and reflow. What is a bench
Electronics Forum | Thu Apr 07 09:26:03 EDT 2011 | alcatel
Im trying to get the XY data to program the SMT machines. since i dont have the file, im trying to convert it from the gerber drawing. the closest one to represent the component placement is the solder pad. ive tried using linkcad to convert it to XY
Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron
Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq
Electronics Forum | Thu Oct 02 15:34:08 EDT 2014 | arifa_anees
the data collected from a standard SMT process is typically very noisy due to the natural.Initially, the most common evaluation method was placement yield.Offset Placement After Solder Screen-printing can reduce or eliminate these defects through cor
Electronics Forum | Sun Sep 21 15:48:48 EDT 2014 | gascon5383
Our company has a process standard that requires a double person check at the beginning of every run (size of run is irrelevent, whether 20 panels or 500 panels). Every changeover that occurs a first piece inspection is made before reflow. If all is
Electronics Forum | Wed Nov 04 11:35:01 EST 2009 | dilogic
1. can you load cut tape onto the feeders, or only reels? You can, but you have to use cover tape extender (pretty cheap, though) >2. how about parts on trays (like Atmel AVRs in the QFP package)? You need tray feeder. But you can "make" your own
Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean
I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting
Electronics Forum | Tue Jul 29 12:51:40 EDT 2008 | grics
I am having some problems with some of my pcbs at ive solder. We are using an ersa versaflow. It has an automated spot/spray fluxer (Interflux Pacific 2009M) , 1 preheat stage, a leaded pot/nozzel, and finally a lead-free pot/nozzel. Nozzels move, b
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th