Electronics Forum | Wed Jan 13 07:37:45 EST 1999 | EFData
We have evaluated using WS-629 and our feelings are that the formula is not very stable. One evaluation showed great results; superior solder joint appearance and good printability. The paste would not roll on another evaluation nor would it release
Electronics Forum | Mon Nov 06 14:21:09 EST 2000 | Kevin
Masking thickness can also play a factor in tombstoning (or the Manhattan Effect). If the pad is 2 mils or more below the surface of the masking this can create a problem. Depending on the thickness of the solderpaste deposition, the solder height
Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson
In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva
Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson
| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Wed Apr 20 18:13:32 EDT 2005 | greg york
With twenty five machines working with the LFB227/S on our little island it does seem to work well. Wetting is good compared to Tin/Copper and flow is comparable to 63/37. Biggest problem sticking 3 - 4 % Ag in a solder ignoring the patents and royal
Electronics Forum | Mon Jan 12 03:55:27 EST 2009 | prkonrad
Sorry, if my first comment was a bit offensive against PCB manufacturers (it was not really intended :( ). We have already discussed the above mentioned issues with the manufacturer, and they stated, that everything is within specification... (and y
Electronics Forum | Fri Mar 27 05:11:24 EDT 2015 | robertwillis
If you want a step by step guide on BGA look at my NPL/IPC "Defect of the Month" video clips https://www.youtube.com/watch?v=MC4K0eSXH18 For other process issues there are also videos which may assist on other process issues like voids, solder ball
Electronics Forum | Tue May 10 10:59:47 EDT 2016 | dtewatt
Hi All, I've been told that 3D AOI machines are a solution to the false calls that you get on a 2D machine, but I don't really see how the depth information can help in eliminating false calls for unreadable markings, misregistered parts etc. For s
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
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