Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua
1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a
Electronics Forum | Thu Feb 18 12:56:18 EST 1999 | Bob Barr
We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board vendo
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Mon May 09 11:29:05 EDT 2016 | jpal
I wanted to bump this up. I am having the same problems. I cannot convince folks it is a solder mask issue and not our process issue, even though it shows up after wave and wash. I can heat the boards and even send them back through the wave preheate
Electronics Forum | Tue May 03 15:04:55 EDT 2016 | sumote
Mainly handling issues. I had some heavy boards (solid copper core) that cost some money, like $1200 ea. As they were oddly heavy that they would catch operators off guard, and scrap was a serious issue. Another thing that i dealt with when process
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Wed Oct 03 09:56:51 EDT 2001 | Claude Tremblay
Hello everyone We have a QFP-308 (0.20" pitch)on a board and we have a lot of opens after reflow. We checked our profil by installing thermocouples on the pads of the component and everythings seems OK. We checked the coplanarity of the leads and it
Electronics Forum | Thu Nov 10 23:43:33 EST 2022 | sarason
Are you using the correct nozzle for 0402? Cant remember the number OTTOMH but 501 rings a bell. somewhere I have the table, it is in the Juki service manual IIRC. This would explain placing all others okay but 0402 is not very good , Senoirtech is c
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Fri Jan 08 18:28:04 EST 1999 | Bill Schreiber
When going to a "no clean" process, there are always two items that will require cleaning - stencils and pallets. You may also have a requirement to clean misprinted PCBs and possibly SMD adhesives. The Smart Sonic Stencil/Pallet Cleaning Process
