Electronics Forum | Wed May 27 09:56:39 EDT 1998 | Chrys
| | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localize
Electronics Forum | Wed May 27 15:09:30 EDT 1998 | Dave F
| | | | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not locali
Electronics Forum | Fri Oct 08 16:58:01 EDT 1999 | Dave F
| | Hi everyone, I am having a problem with cleaning PCB's with different finishes. I run one type of board through a drag solder and it comes out perfect using a water slouble flux then putting it in an aqueous cleaner. Then I run another board with
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Fri Apr 17 14:03:48 EDT 1998 | Earl Moon
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Tue Jun 13 06:20:45 EDT 2006 | bk
Well grant just to let you know i feel your pain. I've been wavesoldering with sn100c since January and let's say i'm still learning everyday. Some of the typical causes of bridges are not enough flux when the board hits the solder. Also it can be bo
Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Tue Oct 03 18:41:16 EDT 2006 | C.K. Flip
With recent implementation of VOC-Free flux in our shop, we've experienced little solder fines/balls on the above combo of VOC-Free, Water Based, and glossy to semi-glossy mask finish on PCB's. The solder balls show up on close conductor spacings, ~
