Electronics Forum | Tue Jul 19 11:53:04 EDT 2005 | CLampron
seaK, Check your PCB Thickness check in your program. See if it is checking the PCB at this location. Each board the machine will check to find the baseline thickness of each board run. It does this with a tool. I'm thinking this may be it because I
Electronics Forum | Wed Aug 10 13:31:05 EDT 2005 | patrickbruneel
Joseph, In addition to my previous post The reason why the cracks are most visible at the transformer location is due to the weight of the transformer. The stress on the boards is the highest because the weight of the transformer will warp the board
Electronics Forum | Wed Aug 10 12:05:11 EDT 2005 | Rob
Hi Pr, No idea what the material is - we haven't usd it for a while now, but it was flush & didn't cause any printing problems on double sided reflow. Your board house should know all about it - I would suggest some but ours are all UK or China/Tai
Electronics Forum | Thu Aug 24 03:20:36 EDT 2006 | aj
we had problems with fillets and shifting aswell,but the recommended print aperture is reduce thermal pad by 35% and offset the lead print by 3thou...i.e. 3thou over hang on outer edge of lead which also moves the paste 3thou in from the inner edge .
Electronics Forum | Fri Sep 08 11:50:39 EDT 2006 | Rob
SN100C is designed not to corrode your pot, and can be used on standard solderpots (after a proper clean out), whereas SACX is still corrosive and if the coating is compromised then could cause problems. Get it in writing from the supplier that the
Electronics Forum | Mon Aug 14 15:09:14 EDT 2017 | charliedci
In my experience, in a temperature/humidity controlled environment, 1 hour, no big deal. 4 hours still ok. Overnight your pushing the limits but will probably reflow without issues. Any longer, could be a problem. Again, a lot depend on type of past
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Wed Jun 27 11:13:44 EDT 2012 | mosborne1
We are seeing PLCC socket leads not soldered in our SMT process. We are using a KIC thermal profiling device and we are on 50% greem light process window. All other solder joints on the board looks great. The solder flowed what looks like perfect on
